At its latest user conference CDNLive in Munich, Cadence focused on artificial intelligence (AI). “The next wave of semiconductor computing is AI”, said Tom Beckley, Senior Vice President and General Manager of Cadence’s Custom IC & Systems Group, in his keynote speech. While the power footprint of existing AI hardware is still way too high, the market for AI processing system is outgrowing the overall semiconductor market by a factor of 3 over the next ten years, Beckley said, adding that the company will invest “massively” into developing related technologies. The total addressable market for AI processors amounts to $10 to $30 billion, added Cadence Marketing Vice President Craig Cochrane.
In this promising environment, the company recently announced the third generation of its JasperGold Formal Verification platform. Now it is going one better with the introduction of a new version of its Tensilica DSP. The new Vision Q7 version of this popular IP (it bears the release number 6) will be streamlined for Simultaneous Localization and Mapping (SLAM) operations, a type of algorithm that is used in robotics, drones, mobile radio and automotive applications to automatically generate or update a map of an unknown environment. Another SLAM use case is inside out tracking in VR/AR environments.